EEE6214 Packaging and Reliability of Microsystems (15 credits)

Year Running: 2015/2016

Credit level: F7

Pre Uni Qualification		This module assumes a successful completion of an Electrical/Electronic Engineering Programme (or course of study) up to FHEQ Level 6 (or equivalent) at Sheffield or elsewhere.
Additional Information		Restricted to students in the Department of EEE

Description

The unit describes the methods used to fabricate microsystems from electronic, opto-electronic and micro-electromechanical (MEMS) devices. It also introduces and develops an understanding of the reliability and failure mechanisms in the devices and resulting microsystems.

Reading List

Please click here for reading list.

Teaching Methods

Delivery Type	Hours
Independent	112.0
Lecture	36.0

Methods of assessment

Assessment Type	Duration	% of formal assessment	Semester
Exam	2.0	75 %
Other	0.0	25 %

Teaching methods and assessment displayed on this page are indicative for 2023-24.